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Possible Bonding Materials(接合可能な素材)
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Possible Bonding Materials
Experience bonding many kinds of metals.
Yamatech has even successfully bonded materials other than SUS, which are said to be difficult for other companies. Yamatech has the skills and technology you can rely on,
* However, depending on the metal, there may be detailed condition settings necessary for processing, so please contact us.
Possible Materials for Diffusion Bonding at Yamatech
Stainless steel (SUS)
SUS303, SUS304, SUS310S, SUS316, SUS316L, SUS430, SUS420J2, SUS440, SUS447, generally all SUS
Nickel-based (Ni)
Alloy 42, Invar, Kovar, Inconel, Monel (Ni + Cu alloy)
Copper-based (Cu)
Oxygen-free copper, phosphor bronze, tough pitch copper
Aluminum (Al)
6061, 6063, 7075
Titanium (Ti)
Other metals
HPM7, HPM38, STAVAX, S55C, SKD61, etc.
Heterogeneous metals
Bonding SUS / copper / SUS 3-layers of dissimilar metals (conditions apply)
We have also been successful in joining other dissimilar metals, but under certain conditions, so please contact us by e-mail.